Reliable IC Programming
&
Functional Testing for Complex PCBA

We support in-circuit programming (ICP) and in-system programming (ISP) for microcontrollers, Flash memory, EEPROMs, and FPGAs. Protocols include JTAG, SWD, SPI, I2C, UART, and proprietary interfaces. We handle encrypted firmware with secure key injection, support over-the-air (OTA) bootloader pre-flashing, and can program multi-image configurations for redundant boot systems common in automotive and medical devices.

We implement strict version control through barcode/QR code scanning at the programming station. Each PCB's serial number is linked to the firmware revision, checksum (CRC/MD5), programming date, and test equipment ID in our MES system. We support secure EEPROM serialization for MAC addresses and calibration data. Full batch records ensure traceability compliant with ISO 13485 and IATF 16949 requirements for medical and automotive sectors.

In-Circuit Test (ICT) checks component placement, orientation, and passive values using bed-of-nails fixtures—it's fast but requires physical test points. Functional Circuit Test (FCT) validates the product's operational performance by powering the unit and testing I/O, communication protocols, sensor accuracy, and actuator responses. We recommend ICT for production ramp-up to catch assembly defects, followed by FCT to verify firmware integration and system-level functionality before packaging.

Yes, we design custom test solutions including pogo-pin fixtures, pneumatic clamping systems, and LabVIEW/Python-based test automation. For products without test point access, we implement boundary scan (JTAG) testing and chip-on-board probing. Our test development includes stimulus generation (simulating sensors, buttons, CAN/LIN bus traffic), measurement acquisition (voltage, current, frequency), and pass/fail criteria based on your technical specifications.

Absolutely. We utilize IEEE 1149.1 boundary scan for BGA and fine-pitch devices where physical probe access is impossible. Our systems support interconnect testing, cluster testing for non-boundary-scan devices, and in-system programming of Flash/CPLDs via JTAG. For high-density boards, we combine boundary scan with AOI/AXI data to achieve >95% fault coverage without requiring expensive bed-of-nails fixtures.

We provide burn-in testing (dynamic operation at elevated temperatures, typically 40-85°C for 24-168 hours) to precipitate early-life failures. For harsh environment products, we offer temperature cycling (-40°C to +125°C), humidity exposure (85°C/85% RH), and power cycling stress tests. All environmental screening includes continuous functional monitoring to detect intermittent faults, soft errors, or thermal shutdowns that wouldn't appear in room-temperature testing.

For RF modules, we conduct calibrated power measurements, frequency response analysis, and impedance testing using vector network analyzers (VNA). High-speed digital interfaces (USB 3.0, HDMI, Ethernet) undergo eye diagram analysis and bit-error-rate (BER) testing. We design shielded test chambers to prevent interference and use calibrated RF cables with minimal insertion loss to ensure measurement accuracy meets your radio certification requirements (FCC, CE, IC).

We provide comprehensive test reports including serialized test logs, parametric data (voltage, current, timing measurements), histograms for statistical process control (SPC), and failure mode analysis. Data is delivered via secure web portal, API integration to your ERP, or encrypted files. We support Industry 4.0 initiatives with real-time dashboard monitoring, predictive analytics for yield optimization, and automated alerts when process parameters drift outside control limits.